Response to Question 2: Hollow Core Technology vs Solid Core/Chemical Etch
Jeff Elam (ANL/ESD) addressed the first issue. The comment came from a misunderstanding, we believe, as there is unanimous
agreement that the solid core/chemical etch process is not "disruptive of ALD" (we have coated solid-core/chemical etch plates with ALD ourselves).
Michael Minot (Incom) addressed the second part of the question, including a discussion of physical robustness,
process control, and cost.
Response to Question 3: "Due Diligence on IP
Terry Maynard, from the Argonne Tech Transfer office, responded to to this and the subsequent discussion.
